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以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
。91视频对此有专业解读
On Monday 30 April, ahead of the May elections, join Gaby Hinsliff, Zoe Williams, Polly Toynbee and Rafael Behr as they discuss how much of a threat Labour faces from the Green party and Reform – and whether Keir Starmer can survive as leader of the Labour party. Book tickets here，更多细节参见safew官方版本下载
// 步骤5：扩展右边界（向右找所有<maxVal的元素，全程不越界）